中圖分類號： TN452 文獻標識碼： A DOI：10.16157/j.issn.0258-7998.200869 中文引用格式： 朱雨生，施靜，陳承. 混合集成技術代際及發(fā)展研究[J].電子技術應用，2021，47(4)：36-45. 英文引用格式： Zhu Yusheng，Shi Jing，Chen Cheng. Research on intergenerational and development of hybrid integration technology[J]. Application of Electronic Technique，2021，47(4)：36-45.
Research on intergenerational and development of hybrid integration technology
Zhu Yusheng1，Shi Jing2，Chen Cheng1
1.The 43rd Research Institute of CETC，Anhui Key Laboretory of Microsystems，Hefei 230088，China； 2.Army Artillery Air Defense Academy，Hefei 230039，China
Abstract： Hybrid integration technology is a kind of high-end packaging technology that directly encapsulates zero level devices into 1-3 level modules or systems to meet the requirements of small volume, light weight, strong function, high reliability, wide frequency, high precision and good stability for aerospace, electronic and weapon equipment. Since the 1970s, hybrid integration technology has gone through the stages from thick/thin film assembly to multi chip module(MCM), system level packaging(SIP), micro system integration and so on. It always focuses on the connection between micro-devices and macro-devices, which is a continuous innovation technology of multi-disciplinary integration for design，material，technics，project，experiment. In this paper, by analyzing and studying the process characteristics, key points and typical products of hybrid integration technology in different periods, the development of hybrid integration technology is divided into four generations by induction and summary. Meanwhile, according to the technical characteristics and trends of different generations, it also tries to predict the development direction of the next generation of hybrid integration technology.
Key words : hybrid integrated circuit；hybrid integration technology；thick/thin film；system in package；generations
